1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.:2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg in halophosphate lamps.:2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg in triphosphate lamps with a normal lifetime.:2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg in triphosphate lamps with long lifetime.:3. Mercury in straight fluorescent lamps for special purposes.:4. Mercury in other lamps not specifically mentioned in this list.:5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.:6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.:6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.:6c. Lead as an alloying element in  copper containing up to 4% lead by weight.:7a. Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).:7b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications.:7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices).:8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations piezoelectronic devices).:9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.:10a. DecaBDE in polymeric applications.:10b. Lead in lead-bronze bearing shells.:11. Lead used in compliant pin connector systems.:"12. Lead  as a coating material for a thermal conduction module c-ring.:"13a. Lead in optical and filter glass.:"13b. Cadmium in optical and filter glass.:"14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.:15. Lead  in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.:16. Lead in linear incandescent lamps with silicate coated tubes.:17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.:18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).:19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).:20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
