:1_Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.:2a_Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg in halophosphate lamps.:2b_Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg in triphosphate lamps with a normal lifetime.:2c_Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg in triphosphate lamps with long lifetime.:3_Mercury in straight fluorescent lamps for special purposes.:4_Mercury in other lamps not specifically mentioned in this list.:5_Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.:6a_Lead as an alloying element in steel containing up to 0.35% lead by weight.:6b_Lead as an alloying element in aluminum containing up to 0.4% lead by weight.:6c_Lead as an alloying element in  copper containing up to 4% lead by weight.:7a_Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).:7b_Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications.:7c_Lead in electronic ceramic parts (e.g. piezoelectronic devices).:8_Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations piezoelectronic devices).:9_Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.:9a_DecaBDE in polymeric applications.:9b_Lead in lead-bronze bearing shells.:11_Lead used in compliant pin connector systems.:12_Lead  as a coating material for a thermal conduction module c-ring.:13a_Lead in optical and filter glass.:13b_Cadmium in optical and filter glass.:14_Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.:15_Lead  in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.:16_Lead in linear incandescent lamps with silicate coated tubes.:17_Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.:18_Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5-Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7-Pb).:19_Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).:20_Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).:21_Lead and cadmium in printing inks for the application of enamels on borosilicate glass.:22_Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.:23_Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames.:24_Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.:25_Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.:26_Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.:27_Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.:28_Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.:29_Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC (*).
